Abstract
Epoxy resin compounds modified with aromatic olefin oligomers for electronic materials were prepared and the properties were studied. Cured compounds modified with aromatic olefin oligomers have been found to be decreased water-absorbing capacity and dielectric constant. As aromatic olefin oligomers, styrene oligomers and indene oligomers were synthesized. Properties of cured systems with indene oligomers were better than that with styrene oligomers, i.e., linear expansion of cured systems with indene oligomers was lower than that with styrene oligomers, and temperature of inflection point in TMA of the former was higher than that of the latter. The phase structures of cured systems were analyzed by relationships between tanδ and temperature. As the results, we found that water-absorbing capacity and dielectric constant of cured systems with indene oligomers decreased without decrease of linear expansion. We considered that the reason why cured systems with indene oligomers showed above good properties was due to the rigid molecular structure of indene oligomers and the good compatibility to cured epoxy resin matrix.
