Abstract
The information of the bond strength development after gluing is very important for the execution management of an adhesively jointed wood structure. From the viewpoint, bonding test and dynamic viscoelasticity measurement of the resin films were performed, and correlation of both the obtained results was investigated. The wood single lap specimens for adhesion tests were prepared using the commercial room temperature setting epoxy resin adhesives and tested after curing at 20℃ to 60℃ which was the onsite conditions to be encountered in actualgluing. Furthermore, the dynamic viscoelasticity of the resin films which cured in the condition same as the adhesion test was measured. The results of dynamic viscoelastic measurement revealed that epoxy resin cured to a certain level with rise of temperature, or progress of time, and the cured resin at the different temperature did not show accordant cure degree. On the other hand, while the bond performance improved with the rise of cure temperature, and progress of cure time, the bond strength of wood joints was hardly affected by the cure degree. It is so that this case, the bond strength of wood joints depends on the intensity of the wood itself.
