Properties of Cured Epoxy Resin/Phenoxy Resin Containing Carboxylic Groups and Phosphorus Blends for Halogen-free Flame-retardancy FPC Adhesives

Abstract

Cured epoxy resin (Ep)/phenoxy resin containing carboxyl groups and phosphorus (COOH-P-Px) blends showed better flow properties with maintaining the good resistant reliability than those of cured Ep/phenoxy resin containing phosphorus (P-Px) blends and cured Ep/phenoxy resin containing carboxyl groups (COOH-Px) blends. That could be depending on rigid molecular structure of 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO) which is a resource of phosphorus and carboxyl groups which can react with epoxy groups. However, since the peel strength of cured Ep/COOH-P-Px blends showed was not improved well, we knew that as a problem we should solve from now on.