Material Design for Improving Toughness of Bismaleimide Resin

Abstract

4,4’-Diphenylmethane bismaleimide（BMI） resin possesses high heat resistance, favorable mechanicaland dielectric properties, and excellent chemical resistance. High heat resistance is due to its aromaticheterocyclicstructure and the high cross-link density of cured resin. Therefore, these polymers havebeen widely used as a matrix for advanced composites in aerospace, electronics, and other related hightechindustries. While the excellent properties of these materials are favorable for real-world applications,the cured resin is brittle due to the high cross-link density of cured network. This drawback has becomemore crucial due to the recent requirements for the improvement in the toughness of BMI resin used inindustries such as aerospace and electronics. In this paper, the material design for improving the toughness ofbismaleimide resin was summarized.