2021 Volume 57 Issue 6 Pages 227-233
It was found that among the bisphenol F type epoxy resins, the highly symmetrical 4,4ʼ-substituted compound(
p-BPF-E) gives a crystalline cured product with a melting point of 149.7℃. As a result of evaluating
the physical properties of the p-BPF-E cured product in the epoxy resin composition filled with alumina, the
thermal conductivity was 4.1 W/m·K( Al2O3; 90 wt%), which was about 1.3 times that of the amorphous cured
product. In addition, the p-BPF-E cured product had high thermal conductivity from room temperature to
around its melting point of 150℃, corresponding to its crystallinity. In addition, it was confirmed that it has a
heat distortion temperature of 154-163℃, low thermal expansion and low water absorption due to the crystallinity
of the cured product.