1995 Volume 11 Issue 3 Pages 533-537
Only three types of specimens can be applied for calibration in TXRF, namely pure particle-, film- or bulk-type samples. In this study "droplet" standards, as a representative of the particle type, and "spin-drying" standards, for film-type samples were examined and compared with a pure metal standard (bulk-type). A test procedure is described which makes it possible to detect faulty calibration samples. An iterative data processing technique is presented which extracts layer characteristics and-to a certain extent-depth profiles from TXRF data as a function of the incident angle. Two selected examples are considered, a Fe-Ti-Fe thin-layer system and an implantation profile of Ni-atoms in silicon. Based on these samples, the capability and limitations of TXRF for depth profiling are discussed.
