Abstract
Micro size electrodeposition technology is the most recent topic in the field of electrochemical engineering. In this report, introduction is given on both the most recent fields and future targets of this micro size electrodeposition technology. The year v.s. characteristics length of the electrodeposited feature is plotted on the semi-log graph. The 90degree bent on this graph in 1980 was driven by the application of electrodeposition technology to the conductors and connectors of electronics devices. The electrodeposited copper conductors line width used in microprocessors have 1/1000 of the diameter of the human hairs(0.1µm).Recent micro size electrodeposition technology is reviewed. The build up printed circuit board, super connect(interconnection between chips and inter-poser) and the copper Damascene electrodeposition used for the conductors inside of the chips(back end line). Also the future targets of this technology are discussed for the FERAM capacitor and MEMS on-chip switch.
