Asian Pacific Confederation of Chemical Engineering congress program and abstracts
Asian Pacific Confederation of Chemical Engineers congress program and abstracts
Session ID : 3P-07-095
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EFFECTS OF ELECTRODE CONFIGURATIONS ON UNIFORMITY OF Cu/C:H FILMS PREPARED BY ECR-MOCVD COUPLED WITH A PERIODIC DC BIAS
Bup-Ju JeonSang-Duk MyungDongjin ByunJoong-Kee Lee
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Abstract
Effect of electrode configuration on uniformity of Cu/C:H film on polymer film was investigated. The electrodes play an important role to generate the electric field around the substrate. The applied working voltage was about (-)1.5kV. The generating electric field from the electrode makes super concentration of copper ions in the space between the electrode and substrate. In the present study, the various thicknesses of electrodes with rectangular and cylindrical shapes were employed and then their various configuration effects on the uniformity of the deposited films was investigated. For cylindrical shape electrodes, high uniform Cu/C:H film can be obtained caused by the parallel coaxial electrode configuration, which may lead the uniform electric fields around the electrode. On the other hand, in the case of rectangular shape electrode, showed non-uniform Cu/C:H film was prepared possibility due to the presence of the edge from rectangular shape. Our results showed that the surface resistance profiles of deposited film with cylindrical electrode were more uniform than that of the rectangular shape electrode. Therefore, it can be conclude that the uniformity of the deposited films was closely related to the electrode configuration such as shape, thickness, grid size and the distance between electrodes. The uniformity of film could be improved by optimizing the parameters related to the electrodes.
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© 2004 The Society of Chemical Engineers, Japan
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