As Ag-Pd dispersoids in the conductive paste the prealloyed powder is superior to the mixed elemental, which is prone to the migration with Ag dissolution and to the expansion due to Pd oxidation. Among the prealloyed powders the highly dispersed one developed by authors has the following features which the conventional agglomerated ones lack. The paste bearing the highly dispersed prealloyed powders possesses higher thixotropy and fluidity sufficient to form the thick and flat electrode more conductive and solder leach resistant. Because of its higher conductivity and adhesion, the Pd content will be able to be reduced to 10% or less if the paste is co-fired at 950°C for 1hr on the glass-ceramic substrate. The Bi2O3 is only one metallic oxide additive to secure the thickness and adhesion of the Ag-Pd electrode.
