Abstract
When a reflection is made about technical progress of metal materials for precision apparatus in the past 30 years it is understood that there has been existing development of communication apparatus including telephone exchanger as main product and also it is to be noted that we are going to enter an era of data communication of electronic exchanger and computer due to fusion with electronics and its main core is the semi-conductor integrated circuit.
The underwritten is, therefore, the explanation of tendency of metal material as the current electronic metals including lead frame material which is used for semi-conductor package being highlighted at present.
