On the estimation of solder joint error by Monte Carlo Method

Abstract

In soldering of a surface mounted device, sometimes solder joint error may be occurred by the manufacture conditions; metal mask, cream solder printing, mounting, re-flow solder temperature, etc. There is nothing provably that presumed the manufacture conditions for controlling a solder joint error, although many causes or measures of soldering error which generated in the manufacture factory are reported. In this paper, “Manhattan phenomenon” is presumed by the Monte Carlo method, which took variation of manufacture conditions into consideration.