Survey Report on the Current Status of Electrically Conductive Adhesives for Solder Replacement and Proposal

Abstract

Electrically conductive adhesives (ECA) have been expected as a solder replacement bonding material. However, its acknowledgement, application status and problems have not been known enough. Micro Bonding Technology Study Group at Japan Institute of Electronic Packaging held questionnaire survey twice to disclose these points. As the result, ECA has been used widely in the application where the merits of ECA were realized. On the other hand, it was revealed that the available information regarding the performances, evaluation methods etc. are limited, users were trying to evaluate or use ECA without enough knowledge. For promotion of ECA, a continuous organization for joint works and study by material suppliers, equipment manufacturers and users is required.