Proceedings of JIEP Annual Meeting
The 16th JIEP Annual Meeting
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Host: Japan Institute of Electronics Packaging

Current State and Problem in Future about Study on Reliability of Lead Free Solder
Kazuhiko TANABE
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Keywords: Lead free solder, Reliability
CONFERENCE PROCEEDINGS FREE ACCESS

Pages 51

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Abstract
[in Japanese]
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© 2002 by The Japan Institute of Electronics Packaging
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