The evaluation of dependence on electroless plating conditions for fine-pitch copper conductor lines in a nano-porous substrate utilized photo-induced selective plating method

Abstract

We have realized fine-pitch Cu conductor lines in a nano-porous substrate utilizing photo-induced selective plating method which includes the growth of fine Cu particles and its electroless plating. The evaluations of fine pitch Cu conductor lines were performed by the observations of the Cu conductor line shape and the Cu filling ratio while changing several conditions of Cu electroless plating. As a result, it was found that the electroless Cu plating behavior in the nano-porous structure and the optimum electroless plating conditions into the nano-porous substrate.