Proceedings of JIEP Annual Meeting
The 18th JIEP Annual Meeting
Session ID : 17A-05
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Host: Japan

Effects of residual silicone in dicing tapes on packaging semiconductors
*akinori sato†, Koichi Nagamoto†, Katsuyoshi Matsuura†, Kazuhiro Takahashi†, Hideo Senoo†, Risayo Inoue†, Motoki Takahashi†
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Keywords: Dicing tape, Silicone, XPS, TOF-SIMS, Thin Small Outline Package
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[in Japanese]
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© 2004 by The Japan Institute of Electronics Packaging
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