Proceedings of JIEP Annual Meeting
The 18th JIEP Annual Meeting
Session ID : 17A-08
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Host: Japan

A Study of Radiation Effect by Lead Frame Connection for Power Devices
*katsuhiko yoshihara†, Yoshinari Ikeda†, Yuji Iizuka†, Mitsuo Yamashita†
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[in Japanese]
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© 2004 by The Japan Institute of Electronics Packaging
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