Proceedings of JIEP Annual Meeting
The 18th JIEP Annual Meeting
Session ID : 17A-09
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Host: Japan

Fine-pitch Interconnection for Chip-on-Chip Packaging by Applying NCP with Dipped Solder Bump on Electro-less Plating
*Watanabe Akihiro†, Toshihiro Mori†, Akira Yamauchi†, Kenzo Hatada†
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[in Japanese]
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© 2004 by The Japan Institute of Electronics Packaging
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