Proceedings of JIEP Annual Meeting
The 18th JIEP Annual Meeting
Session ID : 18A-03
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Host: Japan

Reliability of a Wafer Level Packaging Method with Plastic-core Solder Bumps
*Rina Murayama†, Masato Sumiakwa†, Masashi Ogawa†, Hiroshi Matsubara†
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[in Japanese]

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© 2004 by The Japan Institute of Electronics Packaging
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