Proceedings of JIEP Annual Meeting
The 18th JIEP Annual Meeting
Session ID : 18A-04
Conference information

Host: Japan

Embedded Wafer Level System in a Package
*Osamu Yamagata
Author information
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Download PDF (351K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Abstract
[in Japanese]
Content from these authors
© 2004 by The Japan Institute of Electronics Packaging
Previous article Next article
Favorites & Alerts

Recently viewed articles
Share this page
feedback
 Top