Proceedings of JIEP Annual Meeting
The 19th JIEP Annual Meeting
Session ID : 18B-09
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Host: Japan Institute of Electronics Packaging

Effect on As in lead-free solder on interfacial reaction with stainless steel
*Hiroshi Nishikawa, Tatsuhiko Kobayashi, Tadashi Takemoto
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Keywords: lead-free solder, Interfacial reaction, Stainless steel
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[in Japanese]
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© 2005 by The Japan Institute of Electronics Packaging
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