The 19th JIEP Annual Meeting
Session ID : 16C-04
Conference information
Host: Japan Institute of Electronics Packaging
Opto-electronic film using fluorinated polyimide
*Mitsuo Usui, Hirooki Hirata, Suzuko Ishizawa, Yuzo Ishii, Tsuyoshi Hayashi, Shigehisa Ohki
Author information
Keywords:
Fluorinated polyimide,
Optical waveguide film,
Solder bump,
Flip-chip bonding,
Coefficient of thermal expansion (CTE)
Details
