Proceedings of JIEP Annual Meeting
The 19th JIEP Annual Meeting
Session ID : 17A-01
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Host: Japan Institute of Electronics Packaging

Shear Strength of Solder Joint in Electronic
*Kenta Imao, Yukimasa Yoshizawa, Kouzou Ikegami
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Keywords: Shear Strength
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[in Japanese]
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© 2005 by The Japan Institute of Electronics Packaging
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