Proceedings of JIEP Annual Meeting
The 19th JIEP Annual Meeting
Session ID : 17A-03
Conference information

Host: Japan Institute of Electronics Packaging

The BGA Shear Strength and Microstructure of the Sn-Ag-Cu soldered Joints Interface.
*Yuuya Endou, Kunihiro Noguchi, Takashi Nakamori, Isao Shimizu, Yasuhide Ohno
Author information
Keywords: BGA, Solder, Shear, Microstructure
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Download PDF (368K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Abstract

[in Japanese]

Content from these authors
© 2005 by The Japan Institute of Electronics Packaging
Previous article Next article
Favorites & Alerts

Recently viewed articles
Share this page
feedback
 Top