Proceedings of JIEP Annual Meeting
The 19th JIEP Annual Meeting
Session ID : 17A-07
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Host: Japan Institute of Electronics Packaging

Methods of Inelastic Analysis for Solder Alloys
*Sasaki Katsuhiko, Sakane Masao, Nose Haruo, Takahashi Hiroyuki, Kitano Makoto, Tsukada Yu
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Keywords: Solder Alloy, Inelastic Deformation, Creep, Fatigue Failure, Constitutive Equation
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[in Japanese]
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© 2005 by The Japan Institute of Electronics Packaging
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