Proceedings of JIEP Annual Meeting
The 19th JIEP Annual Meeting
Session ID : 16A-05
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Whisker generation factors and prevention methods from connector
*Hiroyuki Moriuchinoriharu Edanami
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Abstract
We variousuly examine the genelation factor of whisker by the engagement of the connector according to lead free plating use,and report on the result of exmining the whisker prevention methods.As a result,thin plating Sn of FFC found the generation of whisker after the reflow being suppressed in the combination of the connector and FFC.Moreover,the intention to improvement Sn plating is preferable in the future though the Au plating is recommennded nou in the combination with FPC.The simple examination method was examined along with the above-mentioned content.
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© 2005 by The Japan Institute of Electronics Packaging
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