Evaluation of Voids in Sn-3.0Ag-0.5Cu solder joint using X-ray CT system

Abstract

The availability of X-ray CT system for voids in Sn-3.0Ag-0.5Cu solder joint was evaluated. X-ray CT system was a non-destructive analysis and had a capability of setting cross-section at will. Voids were mainly observed at printed circuit board side in Sn-3.0Ag-0.5Cu solder joint. Area of voids at 245degC was larger than area of voids at 235degC or 240degC, maximum value of re-flow temperature. Therefore, X-ray CT system was useful for evaluation of voids in Sn-3.0Ag-0.5Cu solder joint.