Proceedings of JIEP Annual Meeting
The 20th JIEP Annual Meeting
Session ID : 23A-08
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Host: Japan Institute of Electronics Packaging

Observation of Mechanism of Void Generation in Solder Bump using Reflow Simulator
*kanji takagi, Yuji Manba
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Keywords: Reflow Simulator, Void, Ball Grid Array, Lead-Free Solder
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Abstract

Mechanism of Void Generation in Solder Bump was confirmed using Reflow Simulator,which can duplicate and observe visually the state of soldering during Reflow Soldering Process. Void in bump is generated as below. Gas was mixed in solder bump by the contractive force of solder in melting. The gas was exhausted by solder flow while melting but some gases were left in the solder bump.

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© 2006 by The Japan Institute of Electronics Packaging
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