Effect of Hold Time on Thermal Fatigue Life of Sn-Ag-Cu Solder Joints

Abstract

Fatigue life estimation of solder joints is one of the most important areas of research in the development of reliable electronic components.In present study, In the present study, a fatigue life estimation of BGA's solder bumps was carried out based on the FEM analysis using the inelastic constitutive equation of Sn-Ag-Cu. The results showed that the effect of the frequency of thermal cycle on the fatigue life of Sn-Ag-Cu solder bumps was smaller than that of Sn-Pb solder bumps, and the inelastic constitutive equation is satisfactory for the FEM analysis of this kind.