Proceedings of JIEP Annual Meeting
The 20th JIEP Annual Meeting
Session ID : 23A-11
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Host: Japan Institute of Electronics Packaging

Electromotive force at impact shear of solder joint
*tetsuo kumazawa, Noboru Nakayama, Kennichiro Tsubone, Nobutaka Ito, Mitsunori Abe
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Keywords: solder joint, deformation evaluation, strain, electromotive force
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[in Japanese]

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© 2006 by The Japan Institute of Electronics Packaging
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