The 20th JIEP Annual Meeting
Session ID : 23A-10
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Host: Japan Institute of Electronics Packaging
Evaluation of Thermal Fatigue Damage in Flip Chip Structure by Synchrotron Radiation X-ray Micro-tomography
*Hiroyuki Tsuritani, Toshihiko Sayama, Takeshi Takayanagi, Yoshiyuki Okamoto, Kentaro Uesugi, Takao Mori
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