The 17th JIEP Annual Meeting
Session ID : 14A-13
Conference information
Host: japan institute of electronics packaging
Fabrication of Fine High-Density Strip-Line Structure Using Photosensitive Polyimide Insulation layer for LSI packages
*Katsuya Kikuchi, Shigemasa Segawa, Eun-Sil Jung, Hiroshi Nakagawa, Kazuhiko Tokoro, Hiroshi Itatani, Masahiro Aoyagi
Author information
Keywords:
Photosensitive Polyimide,
Strip-Line Structure
Details
