Interconnection of FPC using non-conductive adhesive films

Resin Encapsulated Flex Interconnection(REX)

Abstract

Resin encapsulated flex interconnection (REX) will be reviewed. At first, flex circuits are pressed by a mold to form structured surface on the circuits. Then the flex circuits can be bonded on PCB (printed circuit board) through a non-conductive thermosetting adhesive film. By heat press, the structures on the flex circuits contact with circuits on PCB through the adhesive and plastic deformation occur. The contact point is also metallurgical bonded at heat press.