Proceedings of JIEP Annual Meeting
The 17th JIEP Annual Meeting
Session ID : 14A-16
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Host: japan institute of electronics packaging

Study on stacked-chips assembly with Flip-chip connection
*AKIKO MATSUMURA, KAZUKI UWADA, YUJI HOTTA
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Keywords: Flip chip, Stacked, Reliability, Thermosetting resin
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Abstract

[in Japanese]

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© 2003 by The Japan Institute of Electronics Packaging
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