The 17th JIEP Annual Meeting
Session ID : 14A-17
Conference information
Host: japan institute of electronics packaging
DEVELOPMENT OF PBGA WITH HIGH SPEED I/O
Details
Host: japan institute of electronics packaging
Wirebond-type PBGA which is used forpackaging high speed I/O signal linewith 622MHz was developed. conventionally,expensive packagehas been adopted for ASIC devices withhigh speed I/O signal line.Now we succeeded in reducing packagingcost by reducing length of high speedsignal transmission line thoroughly andinserting adequate power/ground planeinto interposer.In the volume production,preventionof wire flow at molding process was one of the main subjects to be overcome.
