Proceedings of JIEP Annual Meeting
The 17th JIEP Annual Meeting
Session ID : 12A-15
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Host: japan institute of electronics packaging

Wetetching of copper foil for printed circuit boards in a turbulent flow field.
*Takaharu Suzuki, Kazutoshi Matsumura, Katsutoshi Matsumoto, Shoji Taniguchi
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Keywords: etching, copper, Mass transfer, diffusion
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[in Japanese]
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© 2003 by The Japan Institute of Electronics Packaging
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