The 17th JIEP Annual Meeting
Session ID : 12A-16
Conference information
Host: japan institute of electronics packaging
Multi Layered Printed Circuit Board consist of Polyimide having Conductive Paste IVH
*Shouji Itou, Taro Watanabe, Ryoichi Kishihara, Masahiro Okamoto, Hiroki Hashiba, Takaharu Hondo
Author information
Keywords:
Conductive Paste,
Polyimide
Details
