Creep and creep-fatigue standard testing for solders - Recommendation of Japan Society of Materials Science

Abstract

Solder connections used in electronic devices have mechanical damage due to the mismatch of the components connected by solders. A reliable method for generating mechanical data of solders is needed, but no reliable method has been proposed. This presentation proposes two standard testing methods for solders, proposed by the committee on high temperature strength of materials, Japan Society of Materials Science. One is the creep and creep rupture standard testing method and the other is the creep-fatigue standard testing method.