The 17th JIEP Annual Meeting
Session ID : 12B-12
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Host: japan institute of electronics packaging
Thermal Fatigue Life Simulation for Sn-Zn-Bi Lead-free Solder Joints
*Hiroyuki Takahashi, Takashi Kawakami, Minoru Mukai, Izuru Komatsu, Kuniaki Takahashi, Hideki Ogawa
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