The 17th JIEP Annual Meeting
Session ID : 12B-18
Conference information
Host: japan institute of electronics packaging
Effect of Hardening Rule on Stress and Nonlinear Strain Range Evaluation of Lead Free Solder Joint
Keywords:
Solder joint,
Inelastic strain,
stress,
Hardening rule,
FEM analysis,
Isotropic hardening,
Kinematic hardening
Details
