The development of the FR-1 for the surface mounting of reflow by use lead free solder

Abstract

We have developed FR-1 material "PLC-2147 RF" which satisfy the requirement for"High heat resistance toward lead free reflow process, migration resistance for silver and punching workability".This improved material will be able to withstand for two times reflow mounting process with lead free solder, although it had been saying that"FR-1"material can't correspond to lead free solder reflow process before. This report describes the feature of FR-1 material"PLC-2147RF"which correspond to lead free solder reflow process.