Proceedings of JIEP Annual Meeting
The 17th JIEP Annual Meeting
Session ID : 13A-03
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Host: japan institute of electronics packaging

Fine structural control of polyimide film containing Cu nanoparticles and adhesion mechanism with Cu film
*Shingo Ikeda, Kensuke Akamatsu, Hidemi Nawafune, Syozo Mizumoto, Shigehito Deki
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[in Japanese]
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© 2003 by The Japan Institute of Electronics Packaging
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