New via plugging method by using developable conductor paste for multi-layer ceramic substrate

Proceedings of JIEP Annual Meeting

The 17th JIEP Annual Meeting

Session ID : 13A-04

DOI https://doi.org/10.11486/ejisso.2003.0.50.0

Conference information

Host: japan institute of electronics packaging

New via plugging method by using developable conductor paste for multi-layer ceramic substrate

Koji Shibata, *Naoki Yoneda, Shigekatsu Ohnishi

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Keywords: Ceramic, Via, Via Plugging, Conductor paste, Multi-layer ceramic substrate, LTCC

CONFERENCE PROCEEDINGS FREE ACCESS

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Abstract

[in Japanese]

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© 2003 by The Japan Institute of Electronics Packaging

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