Proceedings of JIEP Annual Meeting
The 17th JIEP Annual Meeting
Session ID : 12A-05
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Host: japan institute of electronics packaging

Adsorption of Polyethylene Glycol molecule on electrodeposited copper surfaces
*Toshiaki Matsumoto, Kazuo Kondo, SeungJin Oh
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Keywords: Copper electrodeposited, additive, Polyethylene Glycol
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[in Japanese]

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© 2003 by The Japan Institute of Electronics Packaging
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