For mass-production of acid copper plating bath for via-filling -Present subjects and countermeasures-

Abstract

We developed additive which has good deposition effects to through-hole (deposition effects at corner part) and good filling effects at via-hole.To gain stable filling effects continuously, important factors are control of additive concentration, shape of via-hole, covering power of electroless copper plating at the bottom of via-hole and solution circulation.In this test, we studied reason for decrease in filling effects at mass-production bath and its countermeasure.