Proceedings of JIEP Annual Meeting
The 21th JIEP Annual Meeting
Session ID : 15A-13
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Electrical Properties of Conductive Adhesives Filled with Ag-coated Cu Filler
*Saya Mikami, Hiroshi Nishikawa, Tadashi Takemoto, Nobuhito Terada, Kouichi Miyake, Akira Aoki
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Keywords: Conductive adhesives, Ag coat, Copper particle, Electrical property
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Abstract
[in Japanese]
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© 2007 by The Japan Institute of Electronics Packaging
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