Proceedings of JIEP Annual Meeting
The 21th JIEP Annual Meeting
Session ID : 15A-14
Conference information
Development of the Ni-Fe alloy electrodeposition for Blind Via plating
*Shigefumi Dohi, Naoki Okamoto, Kazuo Kondo
Author information
Keywords: Ni-Fe alloy, electrodeposition, Blind Via, nickel, iron
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Download PDF (98K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Abstract
[in Japanese]
Content from these authors
© 2007 by The Japan Institute of Electronics Packaging
Previous article Next article
Favorites & Alerts

Recently viewed articles
Share this page
feedback
 Top