Abstract
According to the recent trend of compact size of electronics devices, via-filling was developed. However, it is reported that via-filling has poor stability. So we have big subject in productivity and further improvement is required.The Cu+ formed on phosphorus copper anode causes for decrease of via-filling effect. We studied a component to dissolve Cu+ and found it suppresses decrease of via-filling effect. In this paper, we introduce the influence of component to dissolve Cu+ on stability of via-filling and formation of black film on anode.
