Proceedings of JIEP Annual Meeting
The 21th JIEP Annual Meeting
Session ID : 14A-04
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Technology of acid copper plating for through hole filling.
*Hiroshi Ishizuka, Hideki hagiwara, Ryoichi Kimizuka
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Keywords: Trough hole filling, Via filling
CONFERENCE PROCEEDINGS FREE ACCESS

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[in Japanese]
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© 2007 by The Japan Institute of Electronics Packaging
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