Proceedings of JIEP Annual Meeting
The 21th JIEP Annual Meeting
Session ID : 14A-08
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Preparation and Characterization of Ag-nanoparticle Catalyst for Electroless Cu Plating
*Yutaka Fujiwara, Yasuyuki Kobayashi, Takanori Sugaya, Michio Noro, Yasuhiro Hoshiyama, Hidekazu Miyake
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Keywords: Electroless Cu plating, Catalyst, Adsorption, Plating rate
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[in Japanese]
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© 2007 by The Japan Institute of Electronics Packaging
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