Abstract
Tin whisker issue has a long history more than 50 years. By a tremendousamount of trial and error, this problem was tentatively solved by addinglead to tin. Numbers of reports were published on the basic mechanism since1950s. The movement of finer pitch and lead-free interconnection inelectronics has brought this issue again, especially related to reliabilityconcerns. The mechanisms of nucleation and growth are quite complex and westill need to further research to understand the whole image. The currentunderstanding of tin whiskers and possible prevention methods will besummarized.
